Practical Guide to the Packaging of Electronics Thermal and Mechanical Design and Analysis 1st Edition by Ali Jamnia ISBN 0824708229 9780824708658

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Product details:

ISBN 10: 0824708229

ISBN 13: 978-0824708658

Author:  Ali Jamnia 

Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis 1st Edition: Whether you are designing a new system or troubleshooting a current one, this ingenious text offers a wealth of valuable information. The author focuses on reliability problems and the design of systems with incomplete criteria and components and provides a simple approach for estimating thermal and mechanical characteristics of electronic systems.

Practical Guide to the Packaging of Electronics discusses

• Packaging/enclosure design and reliability
  
• Thermal, junction-to-case, and contact interface resistance
  
• Direct and indirect flow system design
  
• Fin design and fan selection
  
• Vital elements of shock and vibration
  
• Thermal stresses and strains in the design and analysis of mechanically reliable systems
  
• Reliability models and system failure
  
• The selection of engineering software to facilitate system analysis
  
• Design parameters in an avionics electronics package

  Practical Guide to the Packaging of Electronics is an excellent refresher for mechanical, biomedical, electrical and electronics, manufacturing, materials, and quality and reliability engineers, and will be an invaluable text for upper-level undergraduate and graduate students in these disciplines.

 

Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis 1st Edition Table of contents:

• Introduction
• Basic heat transfer: conduction, convection, and radiation
• Conductive cooling
• Radiation cooling
• Fundamentals of convective cooling
• Basics of shock and vibration
• Introduction to finite element method
• Design and analysis for mechanically reliable systems
• Electrical reliability
• Some analysis tips in using finite element methods
• Design considerations in an avionics electronic package

 

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