Electromagnetic Compatibility Engineering 1st Edition by Henry Ott 9781118210659 1118210654
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ISBN 10: 1118210654
ISBN 13: 9781118210659
Author: Henry Ott
Praise for Noise Reduction Techniques IN electronic systems “Henry Ott has literally ‘written the book’ on the subject of EMC. . . . He not only knows the subject, but has the rare ability to communicate that knowledge to others.” —EE Times Electromagnetic Compatibility Engineering is a completely revised, expanded, and updated version of Henry Ott’s popular book Noise Reduction Techniques in Electronic Systems. It reflects the most recent developments in the field of electromagnetic compatibility (EMC) and noise reduction¿and their practical applications to the design of analog and digital circuits in computer, home entertainment, medical, telecom, industrial process control, and automotive equipment, as well as military and aerospace systems. While maintaining and updating the core information—such as cabling, grounding, filtering, shielding, digital circuit grounding and layout, and ESD—that made the previous book such a wide success, this new book includes additional coverage of: Equipment/systems grounding Switching power supplies and variable-speed motor drives Digital circuit power distribution and decoupling PCB layout and stack-up Mixed-signal PCB layout RF and transient immunity Power line disturbances Precompliance EMC measurements New appendices on dipole antennae, the theory of partial inductance, and the ten most common EMC problems The concepts presented are applicable to analog and digital circuits operating from below audio frequencies to those in the GHz range. Throughout the book, an emphasis is placed on cost-effective EMC designs, with the amount and complexity of mathematics kept to the strictest minimum. Complemented with over 250 problems with answers, Electromagnetic Compatibility Engineering equips readers with the knowledge needed to design electronic equipment that is compatible with the electromagnetic environment and compliant with national and international EMC regulations. It is an essential resource for practicing engineers who face EMC and regulatory compliance issues and an ideal textbook for EE courses at the advanced undergraduate and graduate levels.
Electromagnetic Compatibility Engineering 1st Table of contents:
PART I: EMC Theory
1: Electromagnetic Compatibility
1.1 INTRODUCTION
1.2 NOISE AND INTERFERENCE
1.3 DESIGNING FOR ELECTROMAGNETIC COMPATIBILITY
1.4 ENGINEERING DOCUMENTATION AND EMC
1.5 UNITED STATES’ EMC REGULATIONS
1.6 CANADIAN EMC REQUIREMENTS
1.7 EUROPEAN UNION’S EMC REQUIREMENTS
1.8 INTERNATIONAL HARMONIZATION
1.9 MILITARY STANDARDS
1.10 AVIONICS
1.11 THE REGULATORY PROCESS
1.12 TYPICAL NOISE PATH
1.13 METHODS OF NOISE COUPLING
1.14 MISCELLANEOUS NOISE SOURCES
1.15 USE OF NETWORK THEORY
SUMMARY
PROBLEMS
REFERENCES
FURTHER READING
2: Cabling
2.1 CAPACITIVE COUPLING
2.2 EFFECT OF SHIELD ON CAPACITIVE COUPLING
2.3 INDUCTIVE COUPLING
2.4 MUTUAL INDUCTANCE CALCULATIONS
2.5 EFFECT OF SHIELD ON MAGNETIC COUPLING
2.6 SHIELDING TO PREVENT MAGNETIC RADIATION
2.7 SHIELDING A RECEPTOR AGAINST MAGNETIC FIELDS
2.8 COMMON IMPEDANCE SHIELD COUPLING
2.9 EXPERIMENTAL DATA
2.10 EXAMPLE OF SELECTIVE SHIELDING
2.11 SHIELD TRANSFER IMPEDANCE
2.12 COAXIAL CABLE VERSUS TWISTED PAIR
2.13 BRAIDED SHIELDS
2.14 SPIRAL SHIELDS
2.15 SHIELD TERMINATIONS
2.16 RIBBON CABLES
2.17 ELECTRICALLY LONG CABLES
SUMMARY
PROBLEMS
REFERENCES
FURTHER READING
3: Grounding
3.1 AC POWER DISTRIBUTION AND SAFETY GROUNDS
3.2 SIGNAL GROUNDS
3.3 EQUIPMENT/SYSTEM GROUNDING
3.4 GROUND LOOPS
3.5 LOW-FREQUENCY ANALYSIS OF COMMON-MODE CHOKE
3.6 HIGH-FREQUENCY ANALYSIS OF COMMON-MODE CHOKE
3.7 SINGLE GROUND REFERENCE FOR A CIRCUIT
SUMMARY
PROBLEMS
REFERENCES
FURTHER READING
4: Balancing and Filtering
4.1 BALANCING
4.2 FILTERING
4.3 POWER SUPPLY DECOUPLING
4.4 DRIVING CAPACITIVE LOADS
4.5 SYSTEM BANDWIDTH
4.6 MODULATION AND CODING
SUMMARY
PROBLEMS
REFERENCES
FURTHER READING
5: Passive Components
5.1 CAPACITORS
5.2 INDUCTORS
5.3 TRANSFORMERS
5.4 RESISTORS
5.5 CONDUCTORS
5.6 TRANSMISSION LINES
5.7 FERRITES
SUMMARY
PROBLEMS
REFERENCES
FURTHER READING
6: Shielding
6.1 NEAR FIELDS AND FAR FIELDS
6.2 CHARACTERISTIC AND WAVE IMPEDANCES
6.3 SHIELDING EFFECTIVENESS
6.4 ABSORPTION LOSS
6.5 REFLECTION LOSS
6.6 COMPOSITE ABSORPTION AND REFLECTION LOSS
6.7 SUMMARY OF SHIELDING EQUATIONS
6.8 SHIELDING WITH MAGNETIC MATERIALS
6.9 EXPERIMENTAL DATA
6.10 APERTURES
6.11 WAVEGUIDE BELOW CUTOFF
6.12 CONDUCTIVE GASKETS
6.13 THE “IDEAL” SHIELD
6.14 CONDUCTIVE WINDOWS
6.15 CONDUCTIVE COATINGS
6.16 INTERNAL SHIELDS
6.17 CAVITY RESONANCE
6.18 GROUNDING OF SHIELDS
SUMMARY
PROBLEMS
REFERENCES
FURTHER READING
7: Contact Protection
7.1 GLOW DISCHARGES
7.2 METAL-VAPOR OR ARC DISCHARGES
7.3 AC VERSUS DC CIRCUITS
7.4 CONTACT MATERIAL
7.5 CONTACT RATING
7.6 LOADS WITH HIGH INRUSH CURRENTS
7.7 INDUCTIVE LOADS
7.8 CONTACT PROTECTION FUNDAMENTALS
7.9 TRANSIENT SUPPRESSION FOR INDUCTIVE LOADS
7.10 CONTACT PROTECTION NETWORKS FOR INDUCTIVE LOADS
7.11 INDUCTIVE LOADS CONTROLLED BY A TRANSISTOR SWITCH
7.12 RESISTIVE LOAD CONTACT PROTECTION
7.13 CONTACT PROTECTION SELECTION GUIDE
7.14 EXAMPLES
SUMMARY
PROBLEMS
REFERENCES
FURTHER READING
8: Intrinsic Noise Sources
8.1 THERMAL NOISE
8.2 CHARACTERISTICS OF THERMAL NOISE
8.3 EQUIVALENT NOISE BANDWIDTH
8.4 SHOT NOISE
8.5 CONTACT NOISE
8.6 POPCORN NOISE
8.7 ADDITION OF NOISE VOLTAGES
8.8 MEASURING RANDOM NOISE
SUMMARY
PROBLEMS
REFERENCES
FURTHER READING
9: Active Device Noise
9.1 NOISE FACTOR
9.2 MEASUREMENT OF NOISE FACTOR
9.3 CALCULATING S/N RATIO AND INPUT NOISE VOLTAGE FROM NOISE FACTOR
9.4 NOISE VOLTAGE AND CURRENT MODEL
9.5 MEASURMENT OF Vn AND In
9.6 CALCULATING NOISE FACTOR AND S/N RATIO FROM Vn-IN
9.7 OPTIMUM SOURCE RESISTANCE
9.8 NOISE FACTOR OF CASCADED STAGES
9.9 NOISE TEMPERATURE
9.10 BIPOLAR TRANSISTOR NOISE
9.11 FIELD-EFFECT TRANSISTOR NOISE
9.12 NOISE IN OPERATIONAL AMPLIFIERS
SUMMARY
PROBLEMS
REFERENCES
FURTHER READING
10: Digital Circuit Grounding
10.1 FREQUENCY VERSUS TIME DOMAIN
10.2 ANALOG VERSUS DIGITAL CIRCUITS
10.3 DIGITAL LOGIC NOISE
10.4 INTERNAL NOISE SOURCES
10.5 DIGITAL CIRCUIT GROUND NOISE
10.6 GROUND PLANE CURRENT DISTRIBUTION AND IMPEDANCE
10.7 DIGITAL LOGIC CURRENT FLOW
SUMMARY
PROBLEMS
REFERENCES
FURTHER READING
PART II: EMC Applications
11: Digital Circuit Power Distribution
11.1 POWER SUPPLY DECOUPLING
11.2 TRANSIENT POWER SUPPLY CURRENTS
11.3 DECOUPLING CAPACITORS
11.4 EFFECTIVE DECOUPLING STRATEGIES
11.5 THE EFFECT OF DECOUPLING ON RADIATED EMISSIONS
11.6 DECOUPLING CAPACITOR TYPE AND VALUE
11.7 DECOUPLING CAPACITOR PLACEMENT AND MOUNTING
11.8 BULK DECOUPLING CAPACITORS
11.9 POWER ENTRY FILTERS
SUMMARY
PROBLEMS
REFERENCES
FURTHER READING
12: Digital Circuit Radiation
12.1 DIFFERENTIAL-MODE RADIATION
12.2 CONTROLLING DIFFERENTIAL-MODE RADIATION
12.3 COMMON-MODE RADIATION
12.4 CONTROLLING COMMON-MODE RADIATION
SUMMARY
PROBLEMS
REFERENCES
FURTHER READING
13: Conducted Emissions
13.1 POWER LINE IMPEDANCE
13.2 SWITCHED-MODE POWER SUPPLIES
13.3 POWER-LINE FILTERS
13.4 PRIMARY-TO-SECONDARY COMMON-MODE COUPLING
13.5 FREQUENCY DITHERING
13.6 POWER SUPPLY INSTABILITY
13.7 MAGNETIC FIELD EMISSIONS
13.8 VARIABLE SPEED MOTOR DRIVES
13.9 HARMONIC SUPPRESSION
SUMMARY
PROBLEMS
REFERENCES
FURTHER READING
14: RF and Transient Immunity
14.1 PERFORMANCE CRITERIA
14.2 RF IMMUNITY
14.3 TRANSIENT IMMUNITY
14.4 POWER LINE DISTURBANCES
SUMMARY
PROBLEMS
REFERENCES
FURTHER READING
15: Electrostatic Discharge
15.1 STATIC GENERATION
15.2 HUMAN BODY MODEL
15.3 STATIC DISCHARGE
15.4 ESD PROTECTION IN EQUIPMENT DESIGN
15.5 PREVENTING ESD ENTRY
15.6 HARDENING SENSITIVE CIRCUITS
15.7 ESD GROUNDING
15.8 NONGROUNDED PRODUCTS
15.9 FIELD-INDUCED UPSET
15.10 TRANSIENT HARDENED SOFTWARE DESIGN
15.11 TIME WINDOWS
SUMMARY
PROBLEMS
REFERENCES
FURTHER READING
16: PCB Layout and Stackup
16.1 GENERAL PCB LAYOUT CONSIDERATIONS
16.2 PCB-TO-CHASSIS GROUND CONNECTION
16.3 RETURN PATH DISCONTINUITIES
16.4 PCB LAYER STACKUP
SUMMARY
PROBLEMS
REFERENCES
FURTHER READING
17: Mixed-Signal PCB Layout
17.1 SPLIT GROUND PLANES
17.2 MICROSTRIP GROUND PLANE CURRENT DISTRIBUTION
17.3 ANALOG AND DIGITAL GROUND PINS
17.4 WHEN SHOULD SPLIT GROUND PLANES BE USED?
17.5 MIXED SIGNAL ICs
17.6 HIGH-RESOLUTION A/D AND D/A CONVERTERS
17.7 A/D AND D/A CONVERTER SUPPORT CIRCUITRY
17.8 VERTICAL ISOLATION
17.9 MIXED-SIGNAL POWER DISTRIBUTION
17.10 THE IPC PROBLEM
SUMMARY
PROBLEMS
REFERENCES
FURTHER READING
18: Precompliance EMC Measurements
18.1 TEST ENVIRONMENT
18.2 ANTENNAS VERSUS PROBES
18.3 COMMON-MODE CURRENTS ON CABLES
18.4 NEAR FIELD MEASUREMENTS
18.5 NOISE VOLTAGE MEASUREMENTS
18.6 CONDUCTED EMISSION TESTING
18.7 SPECTRUM ANALYZERS
18.8 EMC CRASH CART
18.9 ONE-METER RADIATED EMISSION MEASUREMENTS
18.10 PRECOMPLIANCE IMMUNITY TESTING
18.11 PRECOMPLIANCE POWER QUALITY TESTS
18.12 MARGIN
SUMMARY
PROBLEMS
REFERENCES
FURTHER READING
APPENDIX A: The Decibel
A.1 PROPERTIES OF LOGARITHMS
A.2 USING THE DECIBEL FOR OTHER THAN POWER MEASUREMENTS
A.3 POWER LOSS OR NEGATIVE POWER GAIN
A.4 ABSOLUTE POWER LEVEL
A.5 SUMMING POWERS EXPRESSED IN DECIBELS
APPENDIX B: The Ten Best Ways to Maximize the Emission from Your Product
APPENDIX C: Multiple Reflections of Magnetic Fields in Thin Shields
APPENDIX D: Dipoles for Dummies (as well as for all the rest of us without a Ph.D. in electromagnetics)
D.1 BASIC DIPOLES FOR DUMMIES
D.2 INTERMEDIATE DIPOLES FOR DUMMIES
D.3 ADVANCED DIPOLES FOR DUMMIES
SUMMARY
FURTHER READING
APPENDIX E: Partial Inductance
E.1 INDUCTANCE
E.2 LOOP INDUCTANCE
E.3 PARTIAL INDUCTANCE
E.4 GROUND PLANE INDUCTANCE MEASUREMENT TEST SETUP
E.5 INDUCTANCE NOTATION
SUMMARY
REFERENCES
FURTHER READING
APPENDIX F: Answers to Problems
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