Handbook of Silicon Based MEMS Materials and Technologies 1st Edition by Markku Tilli, Mervi Paulasto Kröckel, Teruaki Motooka, Veikko Lindroos ISBN 0815519885 9780815519881

Handbook of Silicon Based MEMS Materials and Technologies 1st Edition by Markku Tilli, Mervi Paulasto-Kröckel, Teruaki Motooka, Veikko Lindroos – Ebook PDF Instant Download/Delivery: 0815519885, 9780815519881

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Product details:

ISBN 10: 0815519885

ISBN 13: 9780815519881

Author:  Markku Tilli, Mervi Paulasto-Kröckel, Teruaki Motooka, Veikko Lindroos 

Handbook of Silicon Based MEMS Materials and Technologies 1st Edition : A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications.
Key topics covered include:

– Silicon as MEMS material
– Material properties and measurement techniques
– Analytical methods used in materials characterization
– Modeling in MEMS
– Measuring MEMS
– Micromachining technologies in MEMS
– Encapsulation of MEMS components
– Emerging process technologies, including ALD and porous silicon Written by 73 world class MEMS contributors from around the globe, this volume covers materials selection as well as the most important process steps in bulk micromachining, fulfilling the needs of device design engineers and process or development engineers working in manufacturing processes. It also provides a comprehensive reference for the industrial R&D and academic communities.

– Veikko Lindroos is Professor of Physical Metallurgy and Materials Science at Helsinki University of Technology, Finland.
– Markku Tilli is Senior Vice President of Research at Okmetic, Vantaa, Finland.
– Ari Lehto is Professor of Silicon Technology at Helsinki University of Technology, Finland.
– Teruaki Motooka is Professor at the Department of Materials Science and Engineering, Kyushu University, Japan.
– Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques
– Shows how to protect devices from the environment and decrease package size for dramatic reduction of packaging costs
– Discusses properties, preparation, and growth of silicon crystals and wafers
– Explains the many properties (mechanical, electrostatic, optical, etc), manufacturing, processing, measuring (incl. focused beam techniques), and multiscale modeling methods of MEMS structures

 

Handbook of Silicon Based MEMS Materials and Technologies 1st Edition Table of contents:

• PART I: Silicon as MEMS Material

  • Chapter 1 Properties of Silicon
  • Chapter 2 Czochralski Growth of Silicon Crystals
  • Chapter 3 Properties of Silicon Crystals
  • Chapter 4 Oxygen in Silicon
  • Chapter 5 Silicon Wafers: Preparation and Properties
  • Chapter 6 Epi Wafers: Preparation and Properties
  • Chapter 7 Thick-Film SOI Wafers: Preparation and Properties
  • Chapter 8 Silicon Dioxides

• PART II: Modeling in MEMS Methods

  • Chapter 9 Multiscale Modeling
  • Chapter 10 Manufacture and Processing of MEMS Structures
  • Chapter 11 Mechanical Properties of Silicon Microstructures
  • Chapter 12 Electrostatic and RF-Properties of MEMS Structures
  • Chapter 13 Optical Modeling of MEMS
  • Chapter 14 Gas Damping in Vibrating MEMS Structures

• PART III: Measuring MEMS

  • Chapter 15 Introduction to Measuring MEMS
  • Chapter 16 Silicon Wafer and Thin Film Measurements
  • Chapter 17 Optical Measurement of Static and Dynamic Displacement in MEMS
  • Chapter 18 MEMS Residual Stress Characterization: Methodology and Perspective
  • Chapter 19 Strength of Bonded Interfaces
  • Chapter 20 Focused Ion and Electron Beam Techniques
  • Chapter 21 Oxygen and Bulk Microdefects in Silicon

• PART IV: Micromachining Technologies in MEMS

  • Chapter 22 MEMS Lithography
  • Chapter 23 Deep Reactive Ion Etching
  • Chapter 24 Wet Etching of Silicon
  • Chapter 25 Porous Silicon Based MEMS
  • Chapter 26 Atomic Layer Deposition in MEMS Technology
  • Chapter 27 Metallic Glass
  • Chapter 28 Surface Micromachining
  • Chapter 29 Silicon Based BioMEMS: Micromachining Technologies

• PART V: Encapsulation of MEMS Components

  • Chapter 30 Introduction to Encapsulation of MEMS
  • Chapter 31 Silicon Direct Bonding
  • Chapter 32 Anodic Bonding
  • Chapter 33 Glass Frit Bonding
  • Chapter 34 Metallic Alloy Seal Bonding
  • Chapter 35 Bonding of CMOS Processed Wafers
  • Chapter 36 Non-destructive Bond Strength Testing of Anodic Bonded Wafers
  • Chapter 37 Wafer-Bonding Equipment
  • Chapter 38 Encapsulation by Film Deposition
  • Chapter 39 Via Technologies for MEMS
  • Chapter 40 Outgassing and Gettering
  • Chapter 41 Dicing of MEMS Devices
  • Chapter 42 Hermeticity Tests

 

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